Low-Outgassing Non-Silicone Thermal Pad NTP-150
Silicone-free low-outgassing thermal pad designed for 800G/1.6T high-speed optical modules. No silicone oil precipitation to avoid lens fogging. Low stress for gaps between optical module housing and heat base, suitable for long continuous operation of computing equipment.
المواصفات
| المعامل | القيمة النموذجية |
|---|---|
| Basic Properties | |
| Thermal Conductivity | 1.5 W/m·K |
| Mechanical | |
| Compression Rate | 30% @15psi |
نظرة عامة
NTP-150 adopts non-silicone formula with ultra-low outgassing and minimal small molecule precipitation to solve lens fogging issues of high-speed optical modules. Soft material with low compressive stress and no mechanical damage to precision optical components. Excellent thermal stability with very low performance degradation under 24/7 continuous operation. Thin custom die-cut sheets fit narrow assembly gaps, widely used for high-speed optical modules and ASIC chips in mass-production of high-end AI servers.