Low-Stress High Thermal Conductivity Silicone Thermal Pad TIF700UU
High-flexibility thermal pad developed for AI servers and high-speed optical modules. Low compressive stress, thermal conductivity of 7W/m·K, excellent resilience, custom die-cutting available. Stable for long-term 24/7 continuous operation and protects GPU & VRM chips from crushing damage.
المواصفات
| المعامل | القيمة النموذجية |
|---|---|
| Thermal Conductivity | 7.0 W/m·K |
| Hardness | 35 Shore OO |
نظرة عامة
F700UU is Huacheng’s core thermal pad designed for computing servers. Soft texture and low assembly pressure prevent damage to high-power GPU and VRM power chips. It has stable thermal cycling aging resistance, low elastic attenuation and stable thermal resistance under long non-stop operation. Custom die-cutting in any shape for automatic assembly of server boards. Suitable for gap filling of GPU, memory modules and VRM power modules, compatible with 800G/1.6T optical module solutions and compliant with RoHS & REACH.