Thermal Management Solution for AI Computing Servers Solves 800G Optical Module Fogging and Chip Damage

Zhisuan Cloud developed self-designed high-density AI computing servers with greatly increased power density. During the test phase of the original thermal material solution, GPU thermal throttling frequently occurred. In addition, 800G high-speed optical modules suffered lens fogging and packet loss, and GPU chips cracked and were scrapped during assembly lamination. Huacheng’s technical team conducted on-site evaluation of the equipment structure, assembly pressure and long-term working conditions. We recommended TIF700UU low-stress high thermal conductivity pads for gap filling of GPU, VRM and memory modules, and adopted NTP-150 silicone-free low-outgassing pads for 800G optical modules. The low compressive stress of materials protects precision chips, and the non-silicone formula prevents lens fogging caused by precipitated small molecules. Multiple thermal cycle aging verifications were completed. The temperature rise of the whole machine meets the target and the optical performance of optical modules remains stable. Custom die-cut materials are compatible with the customer’s automated production line. Mass delivery has started to support stable long-term operation of the customer’s computing data center.