AI Servers & Data Centers
Supply high-performance thermal interface materials for computing servers and optical modules to solve continuous heat dissipation challenges of high-power chips and support stable 24/7 operation.
AI computing capacity expands rapidly and server chip power consumption keeps risin
computing capacity expands rapidly and server chip power consumption keeps rising. Thermal failure becomes the biggest risk for computing equipment. Huacheng develops thermal materials compatible with liquid-cooled and air-cooled architectures for high-density computing hardware to ensure stable and reliable operation of data centers.
Faced with multiple heat dissipation challenges of AI computing equipment such as high power consumption
Faced with multiple heat dissipation challenges of AI computing equipment such as high power consumption, 24/7 continuous operation and optical protection of optical modules
Optimization Solution
- Adopt low-stress and high-flexibility thermal pads to reduce assembly compressive stress and prevent damage to GPU and optical module chips.
Huacheng provides a variety of standardized
Huacheng provides a variety of standardized thermal interface accessories for core heat-generating components such as GPUs, optical modules and memory in AI computing hardware. Compatible with air-cooled and liquid-cooled server architectures, featuring low stress, low outgassing and stable 24/7 long-term heat dissipation to meet mass-production selection requirements of leading computing equipment manufacturers.
| 類別 | 推薦型號 | 適用品牌 | 應用部位 |
|---|---|---|---|
| Silicone Thermal Pad | TIF700UU | Server OEM, GPU & computing board manufacturers | Heat gap between GPU chip & heatsink, VRM power module and memory module |
推薦產品
Low-Stress High Thermal Conductivity Silicone Thermal Pad TIF700UU
