Global AI computing infrastructure expands rapidly. Large model training and generative AI inference keep raising per-server power consumption. New generations of GPU and HBM memory deliver much higher heat flux. Traditional air cooling hits performance limits. Thermal management is moved from late-stage mechanical selection into early chip definition.

Hardware upgrade directly boosts market demand for premium thermal interface materials. Legacy servers mostly adopted standard thermal pads. New high-power computing hardware increasingly uses high-resilience pads, phase-change materials and high-conductivity thermal gels. Dense HBM stacked packaging imposes stricter requirements for low thermal resistance, low bleeding and high stability.

Two clear industry directions emerge: first, advanced composite filler formulations for higher thermal conductivity and minimal aging drift; second, rising adoption of non-silicone materials for optical modules and high-speed interconnects to avoid silicone contamination.

For hardware OEMs, thermal management is no longer secondary engineering work. Early collaboration with material suppliers accelerates R&D cycles and prevents late-stage thermal bottlenecks. We continuously track AI hardware evolution and develop thermal material solutions for next-generation high-power chips.