Project Background The customer is a leading global cloud service provider. In their new 8-GPU high-density AI server, GPU case temperature hit 87℃ under full computing load, exceeding design limits. The original thermal pad lacked sufficient compression recovery; thermal resistance increased after long high-temperature operation and caused thermal throttling risks. The customer required material qualified for mass production in millions of units with superior long-term stability.

Challenges

1. Variable gaps across components required high compressibility to fill uneven interfaces.

2. Continuous high-temperature server operation demanded aging resistance and limited thermal resistance shift after 2000 thermal cycles.

3. Halogen-free formulation required to meet export compliance for global markets.

Our Solution Our thermal team joined early simulation work and selected modified high-resilience thermal pads tailored to gap tolerance. Optimized filler formulation controls thermal resistance drift over aging. Full reliability qualification tests were completed to validate stability under server operating conditions.

Results With custom thermal pads, GPU case temperature stabilized at 66℃ under full load. Thermal throttling risk was eliminated. The material passed all customer qualification tests and entered mass production. This solution has been reused across multiple server generations for the client.