Ultra-Thin Non-Silicone Thermal Gap Pad
Huacheng ultra-thin non-silicone thermal gap pad adopts low-outgassing silicone-free formula with thickness down to 0.2mm, ideal for narrow gaps of 800G/1.6T optical modules & high-density computing boards. Soft low-stress material protects optical components, no volatile precipitates under long-term high temperature to avoid lens fogging. Precision die-cutting available for mass production of communication hardware.
