High Compressibility Non-Silicone Thermal Gap Pad
Huacheng high compressibility non-silicone thermal gap pad features silicone-free low-outgassing formula. High compressibility adapts to assembly tolerance variations and fills irregular gaps between chips and heat sinks. Protect optical parts of optical modules, stable thermal performance during 7×24h long run, resistant to hardening. Custom sizes available, ideal thermal interface material for AI computing and high-speed communication devices.
技术参数
| Thermal Conductivity | |||
|---|---|---|---|
| Thermal Conductivity | 4.0 W/m・K | ||
| Parameter Name | |||
| Thickness Range | 0.5 ~ 3.0 mm | ||
产品概述
Huacheng high compressibility non-silicone thermal gap pad has excellent compression and rebound performance to compensate assembly tolerances and fill uneven interfaces for lower contact thermal resistance. Silicone-free formula prevents volatile contamination and lens fogging. Low elasticity decay under long thermal cycling. Custom die-cutting available for high-speed optical modules and computing boards, passing strict reliability tests from leading manufacturers.