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來自一線實驗室的熱設計工程筆記。
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Key Principles for Thermal Interface Material Selection: Thermal Conductivity Is Not Everything
Many engineers only focus on thermal conductivity when selecting thermal pads or thermal gels. This article breaks down key parameters including gap tolerance, compressibility, insulation and oil bleeding. It introduces the full TIM selection logic for AI computing hardware and helps avoid mass-production reliability failures.
Thermal Pad Implementation for 8-GPU AI Server Cluster
A global cloud provider faced overheating hotspots on high-power GPUs in AI computing servers. We delivered custom high-resilience thermal pads to reduce interface thermal resistance. GPU case temperature dropped from 87℃ to 66℃, supporting 24/7 continuous computing and mass shipment.
AI Computing Drives Thermal Management Upgrade, Surge in Demand for TIM Materials for High-Power Servers
AI large model training and inference push up server power consumption. HBM and high-power GPUs bring new cooling challenges. This article analyzes global computing infrastructure trends, reviews technical evolution of thermal interface materials, and discusses opportunities and technical challenges for material suppliers.