技术参数
| 参数 | 规格 / 典型值 |
|---|---|
| Thermal Conductivity | |
| Thermal Conductivity | 4.0 W/m・K |
| Parameter Name | |
| Thickness Range | 0.5 ~ 3.0 mm |
本节内容暂未提供中文版本，以下显示原文。
Huacheng high compressibility non-silicone thermal gap pad has excellent compression and rebound performance to compensate assembly tolerances and fill uneven interfaces for lower contact thermal resistance. Silicone-free formula prevents volatile contamination and lens fogging. Low elasticity decay under long thermal cycling. Custom die-cutting available for high-speed optical modules and computing boards, passing strict reliability tests from leading manufacturers.